Odisha emerges as fast-growing IT & Semiconductor hub: Vaishnaw

Union Minister for Electronics and Information Technology Ashwini Vaishnaw has said that Odisha is entering a new phase of industrial and technological growth, backed by strong policy support and rising investments. Vaishnaw was speaking after laying the foundation stone for India’s first advanced 3D glass substrate packaging facility at Info Valley in Bhubaneswar on Sunday. Vaishnaw also praised the Odisha government for creating a favourable environment for electronics manufacturing and employment generation. The project, to be set up with an investment of around Rs2,000 crore, is expected to create about 2,500 jobs. 
Chief Minister Mohan Charan Majhi was also present on the occasion. Speaking at the event, Majhi described the initiative as a major milestone in Odisha’s journey to becoming a semiconductor hub and invited global investors to explore opportunities in the state.Majhi informed that the company is investing nearly ₹2,000 crore in the project and the facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and around 13,000 advanced 3DHI modules. He added that Odisha has emerged as the only state in the country where both India’s first compound semiconductor fabrication unit and first 3D glass substrate packaging facility are being established. 
The facility, to be set up by 3D Glass Solutions, will manufacture cutting-edge glass substrate technologies, a first of its kind in the country. The Minister said such advanced packaging will play a key role in the future of semiconductors, especially in areas like artificial intelligence and high-performance computing.